Application Scenarios of Chip Release Film

: 2023/08/08 : admin : 160time

Chip Packaging: In the molding process of chip packaging, the ETFE release film acts as a release layer to prevent encapsulation materials such as epoxy resin from sticking to molds and guarantee packaging quality. It also protects gold‑wire bonding areas against corrosion caused by moisture penetration, suitable for packaging of CPU, GPU and various other chips.

Wafer Processing: Applied to cover wafer surfaces, it effectively protects wafers from mechanical damage and chemical contamination during dicing, grinding and other processes. It provides cushioning protection to preserve wafer integrity and performance.

Lead Frame Protection: During chip bonding to lead frames, the ETFE release film covers the frame surface to stop adhesive overflow and avoid solder‑joint contamination, ensuring reliable electrical connection between chips and lead frames.